Difference: RD53AProbeCard (1 vs. 2)

Revision 22018-05-02 - AtlasjSilicon

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META TOPICPARENT	name="RD53ADAQdevelopment"

RD53A Probe Card

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Check ASIC before and after flip chip to check flip chip bump bonding quality.

Added:

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log

Design

Based on the !RD53A single chip card but remove unnecessary circuit and used only 98 pins for probing. (Thanks Maurice to identify the necessary pins)

Revision 12018-02-09 - KojiNakamura

Line: 1 to 1

Added:

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META TOPICPARENT	name="RD53ADAQdevelopment"

RD53A Probe Card

RD53A Probe Card
Introduction
log
Design
Photo
Probe Station
- How to Use
  - - - Initialization
        
        Loading Sensor
        
        Preparation
        
        Alignment

Introduction

Check ASIC before and after flip chip to check flip chip bump bonding quality.

Design

Based on the !RD53A single chip card but remove unnecessary circuit and used only 98 pins for probing. (Thanks Maurice to identify the necessary pins)

Design : https://cernbox.cern.ch/index.php/s/GpruAhqeFO4QhvE/download?path=%2FKEK%2FRD53A_ProbeCard&files=RD53A_ProbCard.pdf

Pin Assignment : PadPosition.xls

Photo


DSC_3339	DSC_3340	DSC_3341	DSC_3342

DSC_3343	DSC_3344	ProbeCard_Sensor	ProberSoftwareScreen

ProbeStationPhoto1	ProbeStationScreen

There are 10 images in this page

-- Koji Nakamura - 2018-02-09

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