RD53A Probe Card

Introduction

Check ASIC before and after flip chip to check flip chip bump bonding quality.

log

Design

Based on the !RD53A single chip card but remove unnecessary circuit and used only 98 pins for probing. (Thanks Maurice to identify the necessary pins)

Design : https://cernbox.cern.ch/index.php/s/GpruAhqeFO4QhvE/download?path=%2FKEK%2FRD53A_ProbeCard&files=RD53A_ProbCard.pdf

Pin Assignment : PadPosition.xls

Photo

DSC_3339.JPG DSC_3340.JPG DSC_3341.JPG DSC_3342.JPG
DSC_3339  DSC_3340  DSC_3341  DSC_3342 
DSC_3343.JPG DSC_3344.JPG ProbeCard_Sensor.png ProberSoftwareScreen.png
DSC_3343  DSC_3344  ProbeCard_Sensor  ProberSoftwareScreen 
ProbeStationPhoto1.png ProbeStationScreen.png    
ProbeStationPhoto1  ProbeStationScreen    
There are 10 images in this page

-- Koji Nakamura - 2018-02-09

Topic attachments
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JPEGjpg DSC_3339.JPG r1 manage 6733.6 K 2018-02-09 - 17:25 KojiNakamura  
JPEGjpg DSC_3340.JPG r1 manage 5947.2 K 2018-02-09 - 17:25 KojiNakamura  
JPEGjpg DSC_3341.JPG r1 manage 6296.6 K 2018-02-09 - 17:25 KojiNakamura  
JPEGjpg DSC_3342.JPG r1 manage 5969.3 K 2018-02-09 - 17:25 KojiNakamura  
JPEGjpg DSC_3343.JPG r1 manage 6965.0 K 2018-02-09 - 17:25 KojiNakamura  
JPEGjpg DSC_3344.JPG r1 manage 7932.0 K 2018-02-09 - 17:25 KojiNakamura  
Microsoft Excel Spreadsheetxls PadPosition.xls r1 manage 45.0 K 2018-02-09 - 17:48 KojiNakamura  
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Topic revision: r2 - 2018-05-02 - AtlasjSilicon
 
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