Difference: RD53AProbeCard (4 vs. 5)

Revision 52020-09-07 - KatsuyaSato

 
META TOPICPARENT name="RD53ADAQdevelopment"

RD53A Probe Card

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Introduction

Check ASIC before and after flip chip to check flip chip bump bonding quality.

log

Design

Based on the !RD53A single chip card but remove unnecessary circuit and used only 98 pins for probing. (Thanks Maurice to identify the necessary pins)

Design : https://cernbox.cern.ch/index.php/s/MiwFjlIDetdQ8BC?path=%2FKEK%2FRD53A_ProbeCard

Pin Assignment : PadPosition.xls

Photo

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DSC_3339.JPG DSC_3340.JPG DSC_3341.JPG DSC_3342.JPG
DSC_3339  DSC_3340  DSC_3341  DSC_3342 
DSC_3343.JPG DSC_3344.JPG ProbeCard_Sensor.png ProberSoftwareScreen.png
DSC_3343  DSC_3344  ProbeCard_Sensor  ProberSoftwareScreen 
ProbeStationPhoto1.png ProbeStationScreen.png    
ProbeStationPhoto1  ProbeStationScreen    
There are 10 images in this page

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DSC_3339.JPG DSC_3340.JPG DSC_3341.JPG DSC_3342.JPG
DSC_3339  DSC_3340  DSC_3341  DSC_3342 
DSC_3343.JPG DSC_3344.JPG ProbeCard_Sensor.png ProberSoftwareScreen.png
DSC_3343  DSC_3344  ProbeCard_Sensor  ProberSoftwareScreen 
ProbeStationPhoto1.png ProbeStationScreen.png    
ProbeStationPhoto1  ProbeStationScreen    
There are 10 images in this page

  -- Koji Nakamura - 2018-02-09
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Probe Station

How to Use

  1. 富士B4の
 
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