DAQ development for FE65-P2 chip
Introduction
FE65-P2 is the readout ASIC with 65nm processing as pre-pre-production for the RD53A /B chips used by HL-LHC ITK pixel upgrade. more information is available in : motivation talk in AUW April 2016
Timon's talk in AUW April 2016
Timon's Twiki
Bump Bonding at SLAC
DAQ development by SPEC
- Installed CERN CentOS7 to pcatutt21.cern.ch
Koji Nakamura - 2016-04-21 Topic revision: r1 - 2016-04-21 - KojiNakamura
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