Difference: FE65p2ChipDAQ (1 vs. 2)
Revision 22016-05-19 - KojiNakamura
DAQ development for FE65-P2 chipIntroductionFE65-P2 is the readout ASIC with 65nm processing as pre-pre-production for the RD53A /B chips used by HL-LHC ITK pixel upgrade. more information is available in : motivation talk in AUW April 2016
Timon's talk in AUW April 2016
Timon's Twiki
Bump Bonding at SLACDAQ development by SPEC
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--  Koji Nakamura - 2016-04-21 | ||||||||
Revision 12016-04-21 - KojiNakamura
DAQ development for FE65-P2 chipIntroductionFE65-P2 is the readout ASIC with 65nm processing as pre-pre-production for the RD53A /B chips used by HL-LHC ITK pixel upgrade. more information is available in : motivation talk in AUW April 2016
Timon's talk in AUW April 2016
Timon's Twiki
Bump Bonding at SLACDAQ development by SPEC
Koji Nakamura - 2016-04-21 |
View topic | History: r30 < r29 < r28 < r27 | More topic actions...
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