Difference: PixelModuleTestAtKEK (2 vs. 3)
Revision 32016-03-31 - HiromiSawai
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Pixel Module Test @ KEKThis page summarize test detail and results at KEK. | ||||||||
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| > > | Mar. 28 - Apr. 1, 2016 H-SnAg & Ni/In Bump Bonding check for irradiated Modules :https://docs.google.com/spreadsheets/d/1XQdyTdx-bE7dlNhlkT8Kp7bWewFUtU3s1O-In5Y0CQ0/edit#gid=759285440 | |||||||
Aug. 4 - 25, 2015 10th Bump Bonding check for irradiated & repaired Modules : | ||||||||
View topic | History: r3 < r2 < r1 | More topic actions...
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